Study of the formation of alkaline electroless Ni-P coating on magnesium and AZ31B magnesium alloy
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Date
2017Author
Zuleta A.A.
Correa E.
Castaño J.G.
Echeverría F.
Baron-Wiecheć A.
Skeldon P.
Thompson G.E.
Grupo de Investigación de Estudios en Diseño - GED, Facultad de Diseño Industrial, Universidad Pontificia Bolivariana, Sede Medellín, Circular 1 No 70-01, Medellín, Colombia
Grupo de Investigación Materiales con Impacto – MAT&MPAC, Facultad de Ingenierías, Universidad de Medellín, Carrera 87 No 30 – 65, Medellín, Colombia
Centro de Investigación, Innovación y Desarrollo de Materiales – CIDEMAT, Universidad de Antioquia, Carrera 53 No 61-30, Medellín, Colombia
UK Atomic Energy Authority, Culham Centre for Fusion Energy, Abingdon, United Kingdom
Corrosion and Protection Group, School of Materials, The University of Manchester, Oxford Rd., Manchester, United Kingdom
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In this work, alkaline electroless Ni-P coatings were directly formed on commercial purity magnesium and AZ31B magnesium alloy substrates using a process that avoided the use of Cr(VI) compounds. The study focused on two aspects of coating formation: (i) the effect of the substrate roughness on the kinetics of the electroless Ni-P deposition process on magnesium; (ii) the morphological and chemical evolution of the coating on both magnesium and the AZ31B alloy. For these purposes, gravimetric measurements, scanning electron microscopy (SEM), X-ray diffraction (XRD), Rutherford backscattering spectrometry (RBS) and open-circuit potential (OCP) measurements were employed. It is shown that a relatively rough substrate promotes the rapid formation of the Ni-P coating on the substrate surface in comparison with smoother substrates. Furthermore, the presence of fluoride ions derived from the NH4HF2 reagent in the electroless Ni-P plating bath leads to formation of MgF2 a few seconds after immersion in the bath. Subsequently, crystals of NaMgF3, with a cubic morphology, are developed, which later become embedded in the Ni-P matrix. The presence of fluorine species passivates the substrate during coating formation and hence restricts the decomposition of the electroless Ni-P plating bath, which can occur due to release of Mg2 + ions. Finally, according to gravimetric measurements, SEM and XRD, the plating process is initially faster on magnesium than on the alloy. © 2017 Elsevier B.V.
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